SC18IM700IPW,112 – NXP
Part Number:
SC18IM700IPW,112
Manufacturer:
Date Code:
RoHS:
RoHS Compliant
MSL:
3
COO:
Description:
I²C-Bus to SPI Bridge, TSSOP-16
Datasheet:
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Product Details:
Overview
The SC18IM700IPW,112 is an I²C-bus to SPI bridge manufactured by NXP Semiconductors. This device facilitates communication between an I²C master and SPI slave devices. It is housed in a TSSOP-16 package and provides a simple interface for expanding the capabilities of microcontrollers or other I²C-based systems to include SPI peripherals.
Key Features
- I²C-bus to SPI bridge functionality
- TSSOP-16 package
- NXP Semiconductors manufacturer
- Simplified SPI communication protocol
Applications
This I²C to SPI bridge is commonly used in embedded systems requiring communication between devices using different serial protocols. It is suitable for applications where an I²C master needs to interface with SPI-based sensors, memory, or other peripheral ICs.
- Sensor interface
- Data logging systems
- Peripheral expansion
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