THJP2512ASTF – VISHAY

 
Part Number:
THJP2512ASTF
 
 
Manufacturer:
 
 
Date Code:
 
 
RoHS:
RoHS Compliant
 
 
MSL:
 
 
COO:
 
 
Description:

6.40 mm x 3.20 mm Rectangular Thermal Interface Pad

 
 
Datasheet:
 
 
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Product Details:

Overview

The THJP2512ASTF is a rectangular thermal interface pad manufactured by VISHAY. This component facilitates heat transfer between electronic devices and heat sinks or other cooling solutions. It measures 6.40 mm x 3.20 mm and provides a thermally conductive pathway to improve heat dissipation.

Key Features

  • Rectangular shape: 6.40 mm x 3.20 mm
  • Thermal conductivity material
  • Designed for surface contact
  • Facilitates heat dissipation

Applications

This thermal interface pad is commonly used in electronic assemblies where efficient heat removal is necessary to maintain optimal performance and reliability. It is suitable for various applications requiring thermal management.

  • Power amplifiers
  • Voltage regulators
  • Microprocessors
 
 
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