6.40 mm x 3.20 mm Rectangular Thermal Interface Pad
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The THJP2512AST1 is a rectangular thermal interface pad manufactured by VISHAY. This component facilitates heat transfer between electronic devices and heat sinks or other cooling solutions. Its dimensions are 6.40 mm x 3.20 mm, making it suitable for various surface mount applications where efficient thermal management is required.
This thermal interface pad is commonly used to improve thermal conductivity in electronic assemblies. It is designed to fill air gaps and irregularities between surfaces, thereby reducing thermal resistance and enhancing overall system performance.