BMIS-202-F – TBC

 
Part Number:
BMIS-202-F
 
 
Manufacturer:
 
 
Date Code:
 
 
RoHS:
RoHS Compliant
 
 
MSL:
1
 
 
COO:
MEXICO
 
 
Description:

RF Shield Frame, 0.65″ x 0.65″ (16.5mm), Surface Mount.

 
 
Datasheet:
 
 
Spotted a problem with product information? – let us know
ORDER NOW

Stock Quantity: 101

Selling Unit: Each

Quantity Price (ex VAT)
1+ 0.58
10+
50+
100+

101 in stock

Contact us for volume pricing

  • Same day shipping if ordered before 14.00 GMT
  • 6 month warranty on all stock items
  • All stock held and shipped from our UK warehouse
  • Worldwide shipping available, contact us for a quotation
  • We can ship on your DHL or UPS account if required
  • Any import duties or taxes are the responsibility of the receiver
 
Product Details:

Overview

The Laird Technologies EMI BMI-S-202-F is a critical component designed for robust electromagnetic interference (EMI) shielding in sensitive electronic assemblies. Its primary function is to attenuate unwanted RF emissions, ensuring signal integrity and compliance with regulatory standards. A key design consideration for this SMT 2-piece frame shield is the trade-off between shielding effectiveness and thermal management; while its compact 0.650″ x 0.650″ footprint conserves board space, the solder-down mounting requires careful PCB layout to facilitate heat dissipation from adjacent components, preventing thermal runaway under high-power operation.

Key Features

  • Type: RF Shield Frame
  • Dimensions: 0.650″ (16.50mm) L x 0.650″ (16.50mm) W
  • Height: 0.142″ (3.60mm)
  • Mounting: Surface Mount
  • Construction: SMT 2-Piece
  • Packaging: Tape & Reel, Cut Tape, Digi-Reel®

Applications

The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.

  • High-frequency signal coupling in RF front-ends
  • Power sequencing for high-speed DDR memory
  • Isolation of sensitive analog circuits in medical devices
  • Reducing crosstalk in dense multi-layer PCB designs
 
 
Spotted a problem with product information? – let us know