W25Q64JWBYIQ – WINBOND

Overview

The W25Q64JWBYIQ is a 64 Mbit Serial Peripheral Interface (SPI) and Quad SPI Flash memory device manufactured by WINBOND. This integrated circuit provides non-volatile storage with a compact 12-ball WLCSP (Wafer Level Chip Scale Package) form factor. It is designed for applications requiring low power consumption and a small footprint.

Key Features

• 64 Mbit (8MB) capacity
• SPI/Quad SPI interface
• 12-ball WLCSP package
• Non-volatile memory
• Low power operation

Applications

This SPI Flash memory is commonly used in embedded systems for storing firmware, configuration data, and other critical information. Its small size and low power consumption make it suitable for portable and space-constrained devices.

• Wearable electronics
• Mobile devices
• IoT (Internet of Things) devices