THGAMVG9T23BAIL_TRAY – KIOXIA AMERICA INC

Electronic Components
 
Part Number:
THGAMVG9T23BAIL_TRAY
 
 
Manufacturer:
 
 
Date Code:
 
 
RoHS:
RoHS Compliant
 
 
MSL:
 
 
COO:
 
 
Description:

64 GByte eMMC Memory, 3D BiCS3 Technology

 
 
Datasheet:
 
 
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Product Details:

Overview

The THGAMVG9T23BAIL_TRAY is a 64 GByte embedded MultiMediaCard (eMMC) memory module manufactured by KIOXIA AMERICA INC. This device utilizes 3D BiCS3 flash memory technology for data storage. It is designed for integration into embedded systems requiring non-volatile storage.

Key Features

  • 64 GByte storage capacity
  • eMMC interface
  • 3D BiCS3 flash memory
  • Tray packaging

Applications

This eMMC device is commonly used in a variety of embedded applications needing reliable and compact storage. Its characteristics make it suitable for environments where low power consumption and small form factor are important.

  • Mobile devices
  • Industrial control systems
  • IoT devices
 
 
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