SP400-0.007-00-50 – TBC
Part Number:
SP400-0.007-00-50
Manufacturer:
Date Code:
RoHS:
RoHS Compliant
MSL:
1
COO:
UNITED STATES OF AMERICA
Description:
Thermal Interface Pad, Fibreglass, 0.9 W/mK, 11.1 x 7.92 mm, 0.178 mm
Datasheet:
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Product Details:
Overview
The SP400-0.007-00-50 is a thermal interface pad designed for efficient heat transfer between electronic components and heat sinks. This pad, of unknown manufacturer, utilizes a fibreglass substrate to provide a thermal conductivity of 0.9 W/mK. It is supplied in a rectangular format with dimensions of 11.1 mm x 7.92 mm and a thickness of 0.178 mm.
Key Features
- Thermal Conductivity: 0.9 W/mK
- Substrate Material: Fibreglass
- Dimensions: 11.1 mm x 7.92 mm
- Thickness: 0.178 mm
Applications
This thermal interface pad is typically used to improve thermal management in various electronic assemblies by filling air gaps between heat-generating devices and cooling solutions. It ensures reliable thermal performance in diverse operating conditions.
- Semiconductor Cooling
- LED Lighting
- Power Supply Units
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