Header, Shrouded, 3 Position, 5.08mm, Through-Hole, Top Entry, Solder, Cardboard
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The MSTBVA 2.5/ 3-G-5.08 is a shrouded header manufactured by PHOENIX CONTACT. This three-position header features a 5.08mm pitch and is designed for through-hole mounting. It provides a top entry connection point and is suitable for soldering onto printed circuit boards. The component is supplied in cardboard packaging.
This header is commonly used in various electronic assemblies requiring a secure and reliable board-to-wire connection. Its design makes it suitable for applications needing a polarized connection to prevent mis-mating.