64‑Position QFP Socket, 0.5 mm Pitch, Solder Termination, SMD Mount
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The IC51-0644-807 is a 64-position QFP (Quad Flat Package) socket manufactured by YAMAICHI. This socket provides a reliable connection point for QFP integrated circuits with a 0.5 mm pitch. Designed for surface mount device (SMD) assembly, it utilizes solder termination for secure board attachment.
This QFP socket facilitates device programming, testing, and prototyping in various electronic systems. Its design is suitable for environments requiring secure and repeatable connections to QFP packaged ICs.