FK24408DPAK – FISCHER
Part Number:
FK24408DPAK
Manufacturer:
Date Code:
RoHS:
RoHS Compliant
MSL:
COO:
Description:
Copper Heat Sink
Datasheet:
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Product Details:
The FK24408DPAK from FISCHER Elektronik is a passive heat sink designed for surface-mount DPAK (TO-252) semiconductor packages. Constructed from copper, the heat sink leverages copper’s high thermal conductivity (typically around 400 W/mK) to efficiently dissipate heat generated by the DPAK device. The geometry is optimized for maximizing surface area in contact with the component and for promoting convective heat transfer to the surrounding environment. Its mounting configuration is specifically engineered for secure attachment to PCBs, ensuring reliable thermal contact with the DPAK package. The copper material may be treated with a surface finish to enhance corrosion resistance and improve thermal emissivity. Thermal performance is dependent on factors such as airflow, ambient temperature, and the power dissipation of the DPAK component.
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