ESQ-125-12-S-D – SAMTEC

Overview

The Samtec ESQ-125-12-S-D is a high-density 50-position elevated socket connector designed for robust board-to-board interconnections with a 2.54mm pitch. Its key operational characteristic is the ability to maintain reliable signal integrity and current handling up to 5.7A per contact, crucial for power delivery in dense assemblies. A critical design consideration when employing such high-pin-count connectors is managing mechanical stress during mating and unmating cycles; the push-pull fastening mechanism on this ESQ series helps mitigate this, though careful PCB layout is still paramount to prevent solder joint fatigue.

Key Features

• 50 Positions, 2 Rows
• 2.54mm (0.100″) Pitch
• Through Hole Mounting Type
• Gold Contact Finish (30µin)
• 5.7A Current Rating per Contact
• 11.05mm Insulation Height

Applications

The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.

• High-density interconnects in modular instrumentation
• Power and signal distribution in industrial control systems
• Backplane connections for embedded computing modules
• Inter-board communication in telecommunications infrastructure