DW-25-08-G-D-235 – SAMTEC
Part Number:
DW-25-08-G-D-235
Manufacturer:
Date Code:
RoHS:
RoHS Compliant
MSL:
COO:
Description:
50‑Position Header Connector, 0.1″ Stack, Through-Hole
Datasheet:
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Stock Quantity: 9
Selling Unit: Each
| Quantity | Price (ex VAT) |
|---|---|
| 1+ | 3.29 |
| 10+ | |
| 50+ | |
| 100+ |
9 in stock
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- 6 month warranty on all stock items
- All stock held and shipped from our UK warehouse
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Product Details:
Overview
The Samtec DW-25-08-G-D-235 is a high-density, 50-position header designed for robust board-to-board interconnectivity via through-hole mounting. Its critical operational characteristic lies in its 0.100″ (2.54mm) pitch and 0.235″ (5.969mm) stack height, enabling compact system architectures. A key design consideration for this component is managing signal integrity at higher stacking densities; while the gold plating ensures low contact resistance, careful PCB layout and decoupling are essential to mitigate crosstalk and impedance mismatches in high-speed applications.
Key Features
- 50 Positions
- 0.100″ (2.54mm) Pitch
- 0.235″ (5.969mm) Stack Height
- Gold Contact Finish (10.0µin)
- Through Hole Mounting
- Black Insulator Color
Applications
The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.
- High-density mezzanine card stacking
- Signal and power distribution in compact embedded systems
- Interconnection for modular instrumentation
- Backplane connectivity in low-profile chassis
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