D2828-42 – HARWIN
28‑Position DIP IC Socket, Gold Plated Contacts
Stock Quantity: 5
Selling Unit: Each
| Quantity | Price (ex VAT) |
|---|---|
| 1+ | 2.25 |
| 10+ | |
| 50+ | |
| 100+ |
5 in stock
Contact us for volume pricing
- Same day shipping if ordered before 14.00 GMT
- 6 month warranty on all stock items
- All stock held and shipped from our UK warehouse
- Worldwide shipping available, contact us for a quotation
- We can ship on your DHL or UPS account if required
- Any import duties or taxes are the responsibility of the receiver
Overview
The Harwin D2828-42 is a 28-position Dual In-line Package (DIP) socket designed for robust through-hole mounting of integrated circuits. Its primary function is to provide a reliable, socketed interface for components, facilitating ease of replacement and testing in development or production environments. A critical design consideration for such sockets is the trade-off between contact resistance and mating cycles; while gold plating offers excellent conductivity and corrosion resistance, the flash plating on the Harwin D2828-42 necessitates careful handling to avoid premature wear and maintain low contact resistance (10mΩ) over its operational lifespan, especially in high-vibration applications.
Key Features
- 28 Positions (2 x 14 array)
- 0.6″ (15.24mm) Row Spacing
- 0.100″ (2.54mm) Pitch
- Gold Flash Contact Finish (Mating)
- Beryllium Copper Contact Material (Mating)
- Through Hole Mounting
Applications
The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.
- Socketing of microcontrollers and logic ICs in embedded systems
- Prototyping and debugging of digital circuits
- Burn-in and reliability testing of semiconductor devices
- Modular board design for field serviceability
