CX-W125-10-SMT-RC-CF042 – CHERNG WEEI

Electronic Components
 
Part Number:
CX-W125-10-SMT-RC-CF042
 
 
Manufacturer:
 
 
Date Code:
DC24+
 
 
RoHS:
RoHS Compliant
 
 
MSL:
 
 
COO:
 
 
Description:

1.25mm Wire-to-Board Wafer, 10-Pin, DIP/SMT

 
 
Datasheet:
 
 
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Product Details:

Overview

The CX-W125-10-SMT-RC-CF042 is a 1.25mm pitch wire-to-board connector wafer manufactured by CHERNG WEEI. This component provides a reliable interconnection solution for signal and power transmission between a wire harness and a printed circuit board. It features a 10-pin configuration and is designed for both DIP and surface mount technology (SMT) assembly.

Key Features

  • 1.25mm pitch spacing
  • 10-position contact arrangement
  • DIP/SMT compatible mounting
  • Wire-to-board connectivity

Applications

This connector is commonly used in electronic devices requiring compact and dependable wire-to-board connections. Its small form factor and dual mounting capability make it suitable for various industrial and consumer electronics.

  • Consumer electronics assemblies
  • Industrial control systems
  • Data communication equipment
 
 
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