1.25mm Wire-to-Board Wafer, 10-Pin, DIP/SMT
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The CX-W125-10-SMT-RC-CF042 is a 1.25mm pitch wire-to-board connector wafer manufactured by CHERNG WEEI. This component provides a reliable interconnection solution for signal and power transmission between a wire harness and a printed circuit board. It features a 10-pin configuration and is designed for both DIP and surface mount technology (SMT) assembly.
This connector is commonly used in electronic devices requiring compact and dependable wire-to-board connections. Its small form factor and dual mounting capability make it suitable for various industrial and consumer electronics.