B5743-216-M-T3 – HARWIN
Header, Through Hole, 16 Position, 2.00mm Pitch
Stock Quantity: 5
Selling Unit: Each
| Quantity | Price (ex VAT) |
|---|---|
| 1+ | 9.99 |
| 10+ | |
| 50+ | |
| 100+ |
5 in stock
Contact us for volume pricing
- Same day shipping if ordered before 14.00 GMT
- 6 month warranty on all stock items
- All stock held and shipped from our UK warehouse
- Worldwide shipping available, contact us for a quotation
- We can ship on your DHL or UPS account if required
- Any import duties or taxes are the responsibility of the receiver
Overview
The Harwin B5743-216-M-T3 is a 16-position, 2-row, 2.00mm pitch shrouded header designed for robust board-to-board or cable interconnect applications. Its key operational characteristic lies in its high-density pin field coupled with a secure latch-lock mechanism, ensuring reliable mechanical and electrical connections in vibration-prone environments. A critical design consideration for this component is managing the trade-off between its compact form factor and the current carrying capacity, where the 2.2A rating necessitates careful thermal management in high-density power distribution scenarios to prevent excessive temperature rise.
Key Features
- Pitch: 2.00mm (0.079″)
- Positions: 16 (2 Rows)
- Mounting Type: Through Hole
- Termination: Solder
- Contact Material: Phosphor Bronze with Gold Plating
- Current Rating: 2.2A per contact
- Dimensions: 5.56mm (0.219″) Insulation Height
Applications
The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.
- High-density signal routing in industrial control systems
- Secure power and data interconnects in portable medical devices
- Robust mating for sensor arrays in harsh automotive environments
- Compact interconnects for aerospace data acquisition modules
