40 Position DIP Socket, 2.54 mm Pitch, Solder Termination, SMD
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The 840-AG11SM-LF is a 40-position DIP socket manufactured by AUGAT/TYCO. This socket provides a reliable connection point for dual in-line package (DIP) integrated circuits. It features a 2.54 mm pitch between pins and is designed for surface mount (SMD) solder termination onto a printed circuit board.
This DIP socket facilitates prototyping and production assembly of electronic circuits. It is suitable for use in environments where secure and easily replaceable IC mounting is required.