808-AG11D-ESL-LF – TE
Part Number:
808-AG11D-ESL-LF
Manufacturer:
Date Code:
RoHS:
RoHS Compliant
MSL:
1
COO:
CHINA
Description:
DIP Socket, 8-Pin (2×4), 0.3″ Row Spacing, Gold Plated, Through Hole.
Datasheet:
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Product Details:
Overview
The 808-AG11D-ESL-LF is an 8-pin DIP socket manufactured by TE Connectivity. This through-hole socket is designed to accept integrated circuits in a dual in-line package (DIP) configuration. It features a 0.3-inch row spacing and gold-plated contacts for reliable electrical connection. The socket provides a secure and easily replaceable mounting solution for DIP ICs.
Key Features
- 8-Pin DIP Configuration
- 0.3″ Row Spacing
- Through-Hole Mounting
- Gold-Plated Contacts
Applications
This DIP socket is commonly utilized in prototyping, breadboarding, and legacy circuit board designs. Its through-hole mounting and standard pin spacing make it suitable for various electronic projects and applications where easy IC insertion and removal are required.
- Prototyping Circuits
- Breadboard Interfacing
- Legacy System Maintenance
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