53780-0570 – MOLEX

The 53780-0570 is a surface-mount, right-angle header manufactured by Molex. It features a 1.25mm pitch and a 5-position single row configuration. The housing material is likely a high-temperature thermoplastic, suitable for reflow soldering processes per industry standards such as J-STD-020. The contact material is typically a copper alloy, often phosphor bronze or brass, with a plating of tin or gold over nickel to ensure reliable electrical connection and corrosion resistance. The right-angle configuration allows for perpendicular board-to-board or wire-to-board connections, minimizing vertical space requirements. The header is designed for automated pick-and-place assembly and is typically supplied in tape-and-reel packaging. It is commonly used in compact electronic devices requiring dense interconnect solutions, such as mobile phones, wearables, and other portable electronics.