Heat Sink, 35x35x25mm, Black, BGA Anchor, IC Package 35x35mm, aluminum.
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The 374824B60024G is a heat sink manufactured by AAVID THERMALLOY. This component is designed for thermal management of integrated circuits (ICs) in a BGA package. It measures 35x35x25mm and is constructed from aluminum with a black finish. The heat sink utilizes a BGA anchor for secure attachment to the IC package, specifically sized for 35x35mm components.
This heat sink is typically used to dissipate heat generated by ICs in various electronic devices. It is suitable for environments where effective thermal management is crucial for maintaining optimal performance and preventing component failure.