320-AG19DC – TBC
Part Number:
320-AG19DC
Manufacturer:
Date Code:
RoHS:
MSL:
COO:
Description:
DIP Socket, 20 Position, Vertical, 100 Stamped Pins, Dual Leaf Contacts
Datasheet:
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Product Details:
Overview
The 320-AG19DC is a 20-position DIP (Dual In-line Package) socket designed for vertical mounting. This socket facilitates secure and reliable connections for integrated circuits in a DIP package. It features 100 stamped pins and dual leaf contacts for enhanced electrical conductivity and mechanical stability. The manufacturer is currently unknown.
Key Features
- 20 Position DIP Socket
- Vertical Mounting Orientation
- 100 Stamped Pins
- Dual Leaf Contact Design
Applications
DIP sockets are commonly utilized in prototyping, breadboarding, and low-volume production runs. They provide a convenient method for inserting and removing DIP packaged ICs without soldering directly to the component. This allows for easy component replacement and experimentation.
- Prototyping Circuits
- Breadboard Applications
- IC Testing and Evaluation
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