28-526-10 – TBC

The 28-526-10 is a 28-position, zero insertion force (ZIF) DIP socket designed for integrated circuit (IC) packages conforming to the dual in-line package (DIP) standard with a 0.100-inch pin spacing. The socket body is constructed from a durable, likely glass-filled thermoplastic material providing electrical insulation and mechanical stability. Electrical connection is achieved via tin-plated contacts, offering adequate conductivity and solderability for through-hole mounting on printed circuit boards (PCBs). The ZIF mechanism facilitates insertion and removal of ICs without applying force to the component leads, preventing damage during prototyping, testing, or device programming. The socket’s design allows for repeated use and is suitable for applications requiring frequent IC changes or where minimizing lead stress is critical. The absence of manufacturer information necessitates careful verification of dimensions and material properties prior to integration into a design.