2227MC-28-03-F1 – MULTICOMP

Overview

The Multicomp Pro 2227MC-28-03-F1 is a high-density 28-position Dual In-Line (DIL) IC socket designed for reliable component interfacing in demanding environments. Its PBT insulator provides excellent thermal stability, crucial for applications where heat dissipation is a design consideration, while the tin-plated phosphor bronze contacts ensure robust electrical connectivity with a low maximum contact resistance of 20mΩ. A key design trade-off to consider is the potential for increased parasitic capacitance at higher frequencies compared to surface-mount alternatives, necessitating careful layout for sensitive signal integrity applications.

Key Features

• 28 Positions
• 0.3mm Contact Pitch
• Maximum Contact Resistance: 20mΩ
• Minimum Insulator Resistance: 1000MΩ
• Dielectric Withstanding Voltage: 1000VAC (1 minute)
• Operating Temperature Range: -55°C to +125°C

Applications

The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.

• Interfacing of microcontrollers and logic ICs in industrial control systems
• Socketing of communication processors in networking equipment
• Modular board design for test and measurement instrumentation
• Prototyping and development of embedded systems with interchangeable components