2-1761603-7 – TE CONNECTIVITY

Overview

The TE Connectivity AMP-Latch 2-1761603-7 is a 20-position, shrouded vertical header designed for robust board-to-wire interconnections. Its primary function is to provide a secure, polarized mating interface with a 2.54mm pitch, crucial for maintaining signal integrity in high-density applications. A key design consideration for this header is its push-pull fastening mechanism, which offers a tactile confirmation of secure mating, yet engineers must account for potential mechanical stress on the PCB during high-vibration environments, necessitating appropriate board support.

Key Features

• 20 Positions, 2 Rows
• 2.54mm (0.100″) Pitch
• Through Hole Mounting
• Shrouded – 4 Wall Design
• Phosphor Bronze Contacts with Gold Plating (Mating)
• 1A Current Rating per Contact
• Dimensions: 8.89mm (Insulation Height)

Applications

The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.

• High-density signal routing in industrial control systems
• Power and data distribution in medical instrumentation
• Interconnects within automotive electronic control units (ECUs)
• Modular expansion interfaces for test and measurement equipment