00C845401A – CCI
Part Number:
00C845401A
Manufacturer:
Date Code:
N/A
RoHS:
MSL:
N/A
COO:
Description:
BGA Heat Sink, 9.6°C/W, 25x25x9.4mm, Double-Sided Adhesive, for FPGAs.
Datasheet:
Spotted a problem with product information? – let us know
ORDER NOW
Stock Quantity: 21
Selling Unit: Each
| Quantity | Price (ex VAT) |
|---|---|
| 1+ | 1.99 |
| 10+ | |
| 50+ | |
| 100+ |
21 in stock
Contact us for volume pricing
- Same day shipping if ordered before 14.00 GMT
- 6 month warranty on all stock items
- All stock held and shipped from our UK warehouse
- Worldwide shipping available, contact us for a quotation
- We can ship on your DHL or UPS account if required
- Any import duties or taxes are the responsibility of the receiver
Product Details:
Overview
The 00C845401A is a BGA heat sink manufactured by CCI. This component provides thermal management for Ball Grid Array (BGA) integrated circuits, specifically designed for Field Programmable Gate Arrays (FPGAs). It features a thermal resistance of 9.6°C/W and measures 25x25x9.4mm. The heat sink is equipped with double-sided adhesive for secure attachment to the target device.
Key Features
- BGA package compatibility
- Thermal resistance: 9.6°C/W
- Dimensions: 25mm x 25mm x 9.4mm
- Double-sided adhesive mounting
Applications
This heat sink is typically used in electronic systems requiring efficient heat dissipation from BGA-packaged components. It is suitable for environments where maintaining optimal operating temperatures is critical for device performance and longevity.
- FPGA cooling
- Microprocessor thermal management
- High-density circuit boards
Spotted a problem with product information? – let us know