10-5607-04G – AAVID THERMALLOY

Part Number:

10-5607-04G

Manufacturer:

AAVID THERMALLOY

Date Code:

RoHS:

RoHS Compliant

MSL:

COO:

CHINA

Description:

Heat Sink, BGA, 37.4×37.4x10mm, IC=37.5×37.5mm, Push-Pin, Plastic Pins.

Datasheet:

Spotted a problem with product information? – let us know

ORDER NOW

Stock Quantity: 0

GET QUOTE

Contact us for volume pricing

Same day shipping if ordered before 14.00 GMT
6 month warranty on all stock items
All stock held and shipped from our UK warehouse
Worldwide shipping available, contact us for a quotation
We can ship on your DHL or UPS account if required
Any import duties or taxes are the responsibility of the receiver

Product Details:

Overview

The 10-5607-04G is a BGA heat sink manufactured by AAVID THERMALLOY. This component is designed for thermal management of Ball Grid Array (BGA) integrated circuits. It features dimensions of 37.4mm x 37.4mm x 10mm and is compatible with ICs measuring 37.5mm x 37.5mm. Attachment is achieved via push-pin mounting with plastic pins.

Key Features

BGA Heat Sink Design
Dimensions: 37.4 x 37.4 x 10 mm
IC Compatibility: 37.5 x 37.5 mm
Push-Pin Attachment
Plastic Mounting Pins

Applications

This heat sink is typically used to dissipate heat generated by BGA packaged integrated circuits in various electronic devices. Effective thermal management ensures optimal performance and longevity of the IC.

Microprocessors
Memory Modules
FPGA Devices