1-173145-5 – TE CONNECTIVITY

Overview

The TE Connectivity AMPMODU 1-173145-5 is a 60-position, 2.54mm pitch receptacle connector designed for robust board-to-board mating. Its critical operational characteristic lies in maintaining reliable electrical continuity and signal integrity across its 19mm stack height, even under moderate vibration. A key design consideration for engineers is the trade-off between the 3A current rating and the potential for thermal rise in high-density applications, necessitating careful thermal management strategies to prevent degradation of the gold-plated copper alloy contacts and PBT housing.

Key Features

• 60 Positions
• 2.54 mm (0.1 in) Pitch
• 19 mm Stack Height
• 3 A Current Rating
• Gold Contact Plating
• Polybutylene Terephthalate (PBT) Housing

Applications

The component is engineered for deployment in systems requiring high reliability and performance under specific operating conditions. It provides functional stability across the stated design envelope.

• High-density interconnects in industrial control systems
• Signal and power distribution in medical equipment
• Modular expansion interfaces for telecommunications infrastructure
• Backplane connectivity in embedded computing platforms