2.54 mm Right-Angle Through-Hole Header, 2.29 mm Solder Tail
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The TSW12508LDRA is a 2.54 mm pitch right-angle through-hole header manufactured by SAMTEC. This header provides a reliable board-to-board connection with a 2.29 mm solder tail for secure mounting. It is designed for vertical mating and offers a space-saving solution for perpendicular board orientations.
This right-angle header is commonly used in various electronic assemblies requiring perpendicular board connections. It is suitable for applications where space is limited and a robust connection is needed.