Thermal Pad 1.6 W/m.K Silicone 150x105x1mm
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The 3M 5595 1.0MM is a thermal interface material designed for heat dissipation. This thermal pad facilitates efficient thermal transfer between heat-generating components and heat sinks or other cooling devices. Constructed from silicone, it offers a thermal conductivity of 1.6 W/m.K. The pad is supplied in a sheet measuring 150mm x 105mm with a thickness of 1mm.
This thermal pad is suitable for applications requiring effective thermal management in electronic assemblies. Its properties make it appropriate for use in a variety of settings where heat build-up can negatively impact performance or reliability.