Skip navigation

With such a bewildering array of acronyms in the IC world I thought it was time to offer the definitions...

By: Emma Packford-Garrett
Posted: 25th July 2013
Category: General Blog Posts

Chip Carrier

  • BCC – Bump chip carrier
  • CLCC – Ceramic leadless chip carrier
  • LCC – Leaded chip carrier
  • LCCC – Leaded ceramic chip carrier
  • DLCC – Dual lead-less chip carrier
  • PLCC – Plastic leaded chip carrier

Pin Grid Arrays

  • PGA – Pin grid array
  • CPGA – Ceramic pin grid array
  • FCPGA – Flip-chip pin grid array
  • OPGA – Organic pin grid array
  • PAC – Pin array cartridge

Small outline packages

  • SOP – Small outline package
  • CSOP – Ceramic small outline package
  • MSOP – Mini small outline package
  • PSOP – Plastic small outline package
  • PSON – Plastic small outline package with a pin spacing of 0.635mm
  • SOIC – Small outline integrated circuit
  • SSOP – Shrink small outline package
  • TSOP – Thin small outline package
  • TSSOP – This shrink small outline package
  • TVSOP – Thin very small outline package

Ball grid array

  • BGA – Ball grid array
  • CBGA – Ceramic all grid array
  • FBGA – Fine pitch ball grid array
  • LBGA – Low profile ball grid array
  • OBGA – Organic ball grid array
  • TEPBGA – Thermally enhanced plastic ball grid array
  • TFBGA – Thin fine pitch ball grid array
  • PBGA – Plastic ball grid array
  • LFBGA – Low profile fine pitch ball grid array
  • TBGA – Thin ball grid array
  • SBGA – Super ball grid array (above 500pin count)
  • UFBGA – Ultra fine ball grid array

And finally:

Small pin count ICs, transistors and diodes

  • SOD- Small outline diode
  • SOT – Small outline transistor
  • MELF – Metal electrode leadless face
  • TO-XX – wide range of small pin count packages often used for discrete such as transistors or diodes

Flat Package

  • Flatpack – early metal/ ceramic case with flat leads
  • CFP – Ceramic Flat Pack
  • CQFP – Ceramic quad flat pack
  • PQFP – Plastic quad flat pack
  • LQFP – Low-profile quad flat pack
  • QFP- Quad flat pack
  • TQFP – Thin quad flat pack
  • TQFN – Thin quad flat no-lead
  • VQFP- Very-thin quad flat pack
  • QFN – Quad flat pack no leads
  • MQFP- Metric quad flat pack
  • BQFP – Bumpered quad flat pack
  • DFN – Dual flat pack
  • ETQFP- Exposed thin quad flat pack
  • PQFN – Power quad flat pack, no leads and exposed die-pad for heatsinking
  • HVQFN – Heatsink very thin quad flat pack no leads

Through-hole

  • DIP- Dual in-line package
  • SIP- Single in-line package
  • CDIP – Ceramic dual in-line package
  • CERDIP – Glass sealed ceramic dual in-line package
  • QIP – Quadruple in-line package, like a DIP but with staggered pins
  • SDIP- Skinny dual in-line package
  • PDIP- Plastic dual in-line package
  • MDIP- Molded dual in-line package
  • ZIP – Zig-zag in-line package

Surface Mount

  • CGA- Column grid array
  • CCGA – Ceramic column grid array
  • CERPACK – Ceramic package
  • LLP – Lead less lead frame package, a package with a metric pin distribution
  • LGA- Land grid array
  • LTCC – Low temperature co-fired ceramic
  • MCM – Multi-chip module
  • MICRO SMDXT – Micro surface mount device extended technology

Emma Packford-Garrett, 5th July 2013